Apparatus for forming core layers for plywood

Details Apparatus for forming core layers for plywood Apparatus for forming core layers for plywood

1994-05-13

1996-07-30

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

156559, 156578, 118221, 118302, 118685, B05B 114

Patent

active

055408010

ABSTRACT:
An apparatus (12) for use in forming core layers for plywood from a plurality of veneer sections includes a manifold (48) which extends transversely to a work flow path and across which the veneer sections are sequentially moved. An adhesive passage (46) in the manifold (48) is connected in fluid communication with a plurality of modular dispenser guns (44). Each of the modular dispenser guns (44) is connected in fluid communication with either an adhesive dispenser head or a string dispenser head (34). At the adhesive dispenser heads (32), adhesive is engaged by the leading end portion of a veneer section and pressed against the trailing end portion of a next preceding veneer section. At the string dispenser heads (34), string (42) coated with adhesive is applied to downwardly facing major side surfaces of the veneer sections. A plurality of heat conductors (200, 202, and 240) are provided to conduct heat from heaters (96 and 98) in the manifold (48) to the adhesive dispenser heads (32) and the string dispenser heads (34). The heat conductors (200, 202 and 240) have a greater thermal conductivity than the manifold (48). Thus, the heat conductors (200, 202 and 240) may, for example, be formed of copper and the manifold (48) of aluminum.

REFERENCES:
patent: 3900654 (1975-08-01), Stinger
patent: 4044182 (1977-08-01), Aizawa
patent: 4049466 (1977-11-01), Scholl et al.
patent: 4104983 (1978-08-01), Carstedt
patent: 4453159 (1984-06-01), Huff et al.
patent: 4922083 (1990-05-01), Springs et al.
patent: 5145691 (1992-09-01), Kawakami et al.
Known work performed by others prior to the making of the invention disclosed in the above identified application.

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