Apparatus for forming cavity structures using thermally decompos

Details Apparatus for forming cavity structures using thermally decompos Apparatus for forming cavity structures using thermally decompos

1996-06-21

1998-07-28

Sells, James

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Chamber enclosing work during bonding and/or assembly

156 89, 156580, 425111, 425388, 428137, 428138, 428901, B32B 3120

Patent

active

057858004

ABSTRACT:
The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a thermally decomposable surface layer is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves during the lamination process. After the lamination process, the thermally decomposable surface layer is conveniently removed in pyrolysis and binder removal segments of the sinter process without causing damage to the cavity shelves or paste pull-outs.

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