Apparatus for forming bundled conductors to a planar array orien

Metal working – Means to assemble or disassemble – Means to assemble electrical device

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Details

29 33M, 29758, 29884, H01R 4328, B21F 102

Patent

active

053534972

ABSTRACT:
An apparatus for separating and orienting conductors from a bundled array into a planar array includes a grooved template and several elements that cooperate together and with a laminate material to fixedly unite the conductors when disposed in the grooves.

REFERENCES:
patent: 3671366 (1972-06-01), Miller
patent: 4527328 (1985-07-01), Moody et al.
patent: 4570326 (1986-02-01), Meyer et al.
patent: 4825530 (1989-05-01), Komuro
patent: 5005611 (1991-04-01), Hecker

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