Apparatus for forming bonding balls on bonding wires

Electric heating – Metal heating – Wire – rod – or bar bonding

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228 45, B23K 3100

Patent

active

045756023

ABSTRACT:
There is disclosed an improved apparatus for forming a bonding ball on a tip end of the bonding wire. There are provided a capillary member having a through-hole for holding and guiding the bonding wire, and a cylindrical member having an inner diameter larger than the outer diameter of said capillary member and located in a substantially coaxial relation to the capillary member. The cylindrical member is adapted to be reciprocated in the same direction as that of movement of the capillary member but at a velocity slower than the moving velocity of said capillary member. Further, the cylindrical member is ceaselessly supplied with an inert gas. When the tip end of the bonding wire held by the capillary member is moved into the inside space of the cylindrical member because of the moving velocity difference between the capillary member and the cylindrical member in the upward stroke of the reciprocation of the two members, the tip end of the bonding wire is molten so as to form a bonding ball in the inert gas formed within the cylindrical member.

REFERENCES:
patent: 4323759 (1982-04-01), Edson et al.
patent: 4387283 (1983-06-01), Peterson et al.
patent: 4390771 (1983-06-01), Kurtz et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for forming bonding balls on bonding wires does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for forming bonding balls on bonding wires, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for forming bonding balls on bonding wires will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2192331

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.