Apparatus for forming an aluminum interconnect structure on an i

Details Apparatus for forming an aluminum interconnect structure on an i Apparatus for forming an aluminum interconnect structure on an i

1978-04-03

1980-03-11

Mack, John H.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

20412965, 204277, 204297R, C25F 314, C25F 700

Patent

active

041927290

ABSTRACT:
An apparatus for forming an interconnect structure on an integrated circuit chip by employing a single chamber for both the required etching and anodization. It has been discovered that an etchant-electrolyte such as phosphoric acid solution in the ratios of one part phosphoric acid to four parts of water can serve as both an etchant and an electrolyte without causing deterioration of the photoresist pattern representing the interconnect structure.

REFERENCES:
patent: 3317410 (1967-05-01), Croll et al.
patent: 3536594 (1970-10-01), Pritchard
patent: 3554891 (1971-01-01), Duffy et al.
patent: 3732159 (1973-05-01), Platt
patent: 3745100 (1973-07-01), Lasser
patent: 3746632 (1973-07-01), Kuhdorf et al.
patent: 3909368 (1975-09-01), Raymond et al.
patent: 4118303 (1978-10-01), Gibbs

Affiliated with

Also associated with

Rating

Apparatus for forming an aluminum interconnect structure on an i does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for forming an aluminum interconnect structure on an i, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for forming an aluminum interconnect structure on an i will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1999792