Apparatus for forming an adhesive sealed package

Details Apparatus for forming an adhesive sealed package Apparatus for forming an adhesive sealed package

1987-12-28

1989-04-11

Sipos, John

Package making

Means to fill and close preformed receptacle

With separate closure

53383, 53371, 222108, B65B 728, B65B 5102

Patent

active

048194093

ABSTRACT:
A method and apparatus are provided for packaging products between first and second plastic components sealed by using a hot melt adhesive applied by a dispensing applicator in one of several serially arranged stations of a packaging operation. The first plastic component is supported for indexing movement on a transport and moved under a hot melt applicator which is continuously driven in a predetermined path of travel which traverses the entire periphery of the product-loaded first plastic component. The first plastic component is stopped under the applicator for a predetermined dwell time during which the applicator dispenses the hot melt adhesive, then advanced to a position where the second plastic component is applied to form a filled package which is the evacuated and sealed. Apparatus is provided for preventing dripping or stringing of the hot melt adhesives.

REFERENCES:
patent: 2709539 (1959-05-01), Swanson
patent: 2874733 (1959-02-01), Sesler
patent: 3831342 (1974-08-01), Rejsa
patent: 3879917 (1975-04-01), Bassendale
patent: 3981123 (1976-09-01), Flanagan
patent: 4369613 (1983-01-01), Gess
patent: 4416213 (1983-11-01), Sakiya
patent: 4483462 (1984-11-01), Heintz

Affiliated with

Also associated with

Rating

Apparatus for forming an adhesive sealed package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for forming an adhesive sealed package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for forming an adhesive sealed package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-658271