Apparatus for forming a deposited film

Coating apparatus – Gas or vapor deposition – Running length work

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Details

118719, 118723E, 20429807, C23C 1600

Patent

active

055758550

ABSTRACT:
A deposited film forming method includes the steps of: continuously carrying a long substrate into or out of a vacuum chamber, flowing a first deposited film forming gas in a reverse direction parallel to the substrate and opposite to a conveying direction of the substrate from first gas discharging means into the vacuum chamber, exhausting the gas from first gas exhausting means, flowing a second deposited film forming gas in a forward direction parallel to the substrate and equivalent to the conveying direction of the substrate, exhausting the gas through the second gas exhausting means, and applying a discharge energy to the first and second gases.

REFERENCES:
patent: 4664951 (1987-05-01), Doehler
patent: 4928627 (1990-05-01), Lindner
patent: 5174881 (1992-12-01), Iwasaki
patent: 5180434 (1993-01-01), Didio
patent: 5312490 (1994-05-01), Wilkinson

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