Apparatus for forming a corrugated substrate

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156210, 156264, 156362, 156512, 156517, 156556, B32B 3104, B31F 120

Patent

active

057923078

ABSTRACT:
An apparatus for forming a corrugated substrate comprises a first assembly for advancing liner sheets including a corrugated medium and facing sheets and a second assembly for advancing fluting sheets. Each fluting sheet has bend surfaces along its top and bottom sides. An applicator applies adhesive along at least one of the top and bottom sides of the fluting sheets. The first assembly and second assembly advance the liner sheets and fluting sheets into contact with one another along the side of the fluting sheet having the adhesive. The fluting sheets are secured to the liner sheets to form a layered article having an upper and lower surface. A means for correlating operates the first assembly, second assembly, and applicator so that in each cycle of operation the layered article adheres to at least an additional layered article in succession. The correlating means preferably operates such that another one of the liner sheets adheres along an exposed one of the top and bottom sides of one of the fluting sheets of the layered article corresponding to the upper and lower surface of the layered article, respectively.

REFERENCES:
patent: 1802880 (1931-04-01), Cumfer
patent: 1955833 (1934-04-01), Romanoff
patent: 2504473 (1950-04-01), Van Antwerpen
patent: 2856826 (1958-10-01), Norquist et al.
patent: 3150576 (1964-09-01), Gewiss
patent: 3228273 (1966-01-01), Huffman
patent: 3468734 (1969-09-01), Shields
patent: 3470053 (1969-09-01), Rule
patent: 3792952 (1974-02-01), Hamon
patent: 4306932 (1981-12-01), Bradatsch et al.
patent: 4314868 (1982-02-01), Hirakawa et al.
patent: 4493743 (1985-01-01), Lunding
patent: 4647063 (1987-03-01), Piringer et al.
patent: 4657611 (1987-04-01), Guins
patent: 4792325 (1988-12-01), Schmidtke
patent: 4886563 (1989-12-01), Bennett et al.
patent: 4935082 (1990-06-01), Bennett et al.
patent: 5062340 (1991-11-01), Greven
patent: 5083996 (1992-01-01), Smith
patent: 5147480 (1992-09-01), Lang
patent: 5151151 (1992-09-01), Kao et al.
patent: 5201513 (1993-04-01), Mion
patent: 5217556 (1993-06-01), Fell
patent: 5413662 (1995-05-01), Skinner, III
patent: 5433156 (1995-07-01), Hutchison

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for forming a corrugated substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for forming a corrugated substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for forming a corrugated substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-385481

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.