Apparatus for fluid pressure imprint lithography

Details Apparatus for fluid pressure imprint lithography Apparatus for fluid pressure imprint lithography

2008-01-29

2008-01-29

Colilla, Daniel J. (Department: 2854)

Printing

Embossing or penetrating

Die members

C101S483000, C438S020000, C438S690000, C438S945000, C425S385000, C425S405100, C264S571000

Reexamination Certificate

active

07322287

ABSTRACT:
Improved apparatus for imprint lithography involves using direct fluid pressure to press a mold into a substrate-supported film. Advantageously the mold and/or substrate are sufficiently flexible to provide wide area contact under the fluid pressure. Fluid pressing can be accomplished by sealing the mold against the film and disposing the resulting assembly in a pressurized chamber. The result of this fluid pressing is enhanced resolution and high uniformity over an enlarged area.

REFERENCES:
patent: 5947027 (1999-09-01), Burgin et al.
patent: 5993189 (1999-11-01), Mueller et al.
patent: 6062133 (2000-05-01), Blalock
patent: 6190929 (2001-02-01), Wang et al.
patent: 6429443 (2002-08-01), Mankos et al.
patent: 6482742 (2002-11-01), Chou
patent: 2003/0006529 (2003-01-01), Ho et al.
patent: 2006/0043626 (2006-03-01), Wu et al.
patent: WO 01/42858 (2001-06-01), None

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