Apparatus for flattening a substrate and method thereof

Typewriting machines – Sheet or web – Including sheet guide

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C400S601000, C400S645300, C400S645400, C399S406000, C026S098000

Reexamination Certificate

active

06742948

ABSTRACT:

BACKGROUND OF THE INVENTION
Industrial sheet-to-sheet printers are typically large format machines capable of printing on different substrates of variable sizes and thickness. These printers may be suitable for printing, for example, cardboard sheets, paperboard, box boards, corrugated boards, vinyl sheets, metal sheet and wooden sheets. In order to ensure the quality of printing, the print head moves in close proximity, typically one to two millimeters, to the printed substrates. Some substrates tend to bend upwards at the edges, thus encountering the print head during printing and damaging it. This problem is also related to a variety of other manufacturing processes where the distance between a substrate and a moving tool is required to be very small. Such processes may be related, for example, to spreading systems, gluing systems and spraying systems.


REFERENCES:
patent: 3387814 (1968-06-01), Fischer
patent: 4069999 (1978-01-01), Rew
patent: 4158905 (1979-06-01), O'Leary
patent: 4273457 (1981-06-01), Noda
patent: 5042121 (1991-08-01), Young, Jr.
patent: 5384938 (1995-01-01), Frederick
patent: 5518229 (1996-05-01), Tahara et al.
patent: 5577444 (1996-11-01), Toyama
patent: 5927702 (1999-07-01), Ishii et al.
patent: 6102595 (2000-08-01), Satoh et al.
patent: 6305857 (2001-10-01), Crowley et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for flattening a substrate and method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for flattening a substrate and method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for flattening a substrate and method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3310171

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.