Apparatus for feeding wire to a wire bonding mechanism

Details Apparatus for feeding wire to a wire bonding mechanism Apparatus for feeding wire to a wire bonding mechanism

1983-09-19

1986-02-25

Ramsey, Kenneth J.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228 45, 228179, 226 44, 226108, 226111, H01L 2192

Patent

active

045724210

ABSTRACT:
An apparatus for supplying wire to a wire bonding mechanism is presented. Lengths of wire are fed to a low mass wire-loop reservoir while the bonding process is taking place. Wire is then supplied, at a high speed, from the wire-loop reservoir for the next bonding operation. The amount of wire supplied is precisely measured by measuring the change in the amount of wire stored in the reservoir. The apparatus can supply both single lead wire and twin lead wire. When twin lead wire is supplied, the two wires of the twin lead are separated at predetermined points before being fed to the wire-loop reservoir.

REFERENCES:
patent: 3612369 (1971-10-01), Grebe et al.
patent: 3646307 (1972-02-01), Hazel
patent: 4422583 (1983-12-01), Maxner et al.

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