Apparatus for fastening semiconductor components to substrates

Details Apparatus for fastening semiconductor components to substrates Apparatus for fastening semiconductor components to substrates

1989-12-05

1991-11-26

Ramsey, Kenneth J.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Including compliant cushioning medium

28 447, B23K 2002

Patent

active

050676474

ABSTRACT:
A method and apparatus for fastening semiconductor components, such as power semiconductors, onto substrates is a diffusion welding method wherein the surfaces to be joined are provided with precious metal contact layers and are pressed together with at least 500 kp/cm.sup.2 at a moderate temperature of approximately 150 to 200 degrees C. Components which have a structured or shaped upper side can be joined to substrates when they are inserted in common with a member of elastically deformable material, such as silicone rubber, into a receptacle chamber that is closed by a movable die which transmits the pressing power. The deformable member completely fills out the remaining interior of the receptacle chamber when the pressing power is reached.

REFERENCES:
patent: 3501832 (1970-03-01), Iwata et al.
patent: 3541673 (1970-11-01), Cushman
patent: 3670396 (1972-06-01), Lindberg
patent: 4111024 (1978-09-01), Dahlman et al.
patent: 4756752 (1988-07-01), Barnard
patent: 4810672 (1989-03-01), Schwarzbauer

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