Apparatus for fastening electronic components to substrates

Details Apparatus for fastening electronic components to substrates Apparatus for fastening electronic components to substrates

1989-12-05

1991-10-22

Ramsey, Kenneth J.

Metal fusion bonding

Including means to force or clamp work portions together...

228 55, H01L 2158

Patent

active

050587960

ABSTRACT:
A pressure sintering method and apparatus provides that surfaces to be joined are pressed together with a pressure of at least 900 N/cm.sup.2 at a sintering temperature upon the interposition of a metal powder paste which serves to fasten electronic components, such as power semiconductors, to substrates. Components having a structural upper side can be pressure sintered when they are inserted into a receptacle chamber closed by a movable die together with a member of elastically deformable material, such as silicone rubber, which transmits the sintering pressure. The deformable member completely fills out the remaining space of the receptacle chamber when the sintering pressure reached.

REFERENCES:
patent: 3501832 (1970-03-01), Iwata et al.
patent: 3541673 (1970-11-01), Cushman
patent: 3670396 (1972-06-01), Lindberg
patent: 4111024 (1978-09-01), Dahlman et al.
patent: 4756752 (1988-07-01), Barnard
patent: 4810672 (1989-03-01), Schwarzbauer

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