Apparatus for facilitating interconnection of antenna lead wires

Communications: radio wave antennas – Antennas – With housing or protective covering

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Details

343788, 257701, 342 51, 606116, H01Q 1400, H01Q 1270, G01S 13080, H01L 23060

Patent

active

052238512

ABSTRACT:
A method and apparatus for facilitating interconnection of antenna lead wires to an integrated circuit and encapsulating the assembly to form an improved miniature transponder device including the provision of an additional protective layer of insulation to the top of an integrated circuit chip or die and the provision of enlarged plated electrodes to the surface of the additional insulation to form enhanced bonding pads, such pads being electrically connected through the protective layers to the normal bonding pads of the integrated circuit device. The enhanced bonding pads are made of a soft conductive metal such that external wires to be attached thereto can be bonded to the pads using a thermal compression bonding technique, This invention also extends to a method of encapsulating a transponder in heat shrunk plastics material.

REFERENCES:
patent: 4273859 (1981-06-01), Mones et al.
patent: 4695926 (1987-09-01), McDermott
patent: 4733289 (1988-03-01), Tsurumaru
patent: 4984061 (1991-01-01), Matsumoto
patent: 4992794 (1991-02-01), Brouwers

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