Electric heating – Metal heating – By arc
Reexamination Certificate
2001-01-19
2003-06-24
Elve, M. Alexandra (Department: 1725)
Electric heating
Metal heating
By arc
C219S121850, C219S121720, C427S596000
Reexamination Certificate
active
06583381
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to an apparatus and technique for fabrication of a variety of miniature structures such as semiconductor chips, optical, chemical, biological, environmental, physical, electromagnetic detectors/sensors, mechanical and electromechanical elements and actuators, antennae, different electronic components, as well as vias, channels, guides, etc.
More particularly, the present invention relates to an apparatus and technique for fabrication of miniature structures where the Direct Write (additive process) and micromachining (subtractive process) are carried out with and in the same fabrication tool by means of synchronous control and manipulation of elements of the fabrication tool.
Still further, the present invention relates to an apparatus having a control mechanism which operates the fabrication apparatus in either of two modes of operation: “material transfer” and/or “material removal” modes of operation. The additive process, such as Laser Forward Transfer, or Laser Induced Forward Transfer methodologies are carried out during the “material transfer” mode of operation to deposit materials on the substrate surface and to create additive structures such as various detectors, sensors, actuators, semiconductor chips, etc. In the “material removal” mode of operation a subtractive process is carried out resulting in a material removal from the workpiece by means of ablation, evaporation, melting, cutting, drilling, etc. of the workpiece, thus creating channels, guides, vias. During the “material removal” mode of operation, the fabrication tool performs as a micromachining workstation so that the substrate with the structures previously created thereon during the “material transfer” mode of operation may be diced or excised into individual subunits, and can be trimmed or shaped to precise specified values.
Further, the present invention relates to an apparatus and method in which a controllable energy or energetic beam is directed towards a substrate where a material carrier element having a deposition layer formed thereon is displaceably positioned in spaced relationship with the substrate. A control unit synchronously manipulates the material carrier element and the energy beam in accordance with the type of the structure to be manufactured.
In this manner, in a “material removal” mode of operation, the control unit displaces the material carrier element away from interception with the energy beam so that the energy beam impinges onto the surface of the substrate in a predetermined manner and disintegrates the surface material of the substrate to a predetermined depth.
Further, in the “material transfer” mode of operation, the control mechanism displaces the material carrier element into a position intercepting the energy beam so that the energy beam modifies the deposition layer on the material carrier element, and causes transfer and deposition of the deposition material onto the surface of the substrate in accordance with a predetermined pattern.
In both modes of operation, for performing patterned removal of the material from the surface of the substrate or patterned deposition of the material onto the surface of the substrate, the control unit changes the relative position between the energy beam and the substrate in a patterned manner.
BACKGROUND OF THE INVENTION
Miniature structures having electrical components are widely used in a variety of consumer and industrial items, such as TV sets, radios, cars, kitchen appliances, computers, etc.
Due to the need for such miniature structures, such as computer chips, and other mechanical and electromechanical elements, different manufacturing processes have been developed.
Methodologies of manufacture include, among others, additive Direct Write processes such as Laser Forward Transfer (LFT), Matrix Assistant Pulse Laser Evaporation, or Laser Induced Forward Transfer (LIFT) techniques, well-known to those proficient in the miniature structure fabrication art.
In the course of these techniques, a material from the deposition material source is transferred towards a substrate and is deposited thereon in accordance with a predetermined pattern either to manufacture a single structure or a plurality of structures on the same substrate. Simultaneously, a subtractive process is employed using laser energy to ablate, evaporate, melt, cut, drill, or otherwise remove material from the workpiece. In this manner, channels, guides, or vias can be laser milled or drilled. Additionally, a substrate with a plurality of structures may be excised into individual subunits, trimmed or shaped.
Although both additive and subtractive processes are well-developed and known in the miniature structures manufacturing industry, there is a drawback which still exists resulting from the necessity to transfer the substrate with deposited structures thereon from one area (where the additive Direct Write process takes place) to a micromachining workstation, or conversely, from a micromachining station where the surface cleaning takes place to a material deposition area.
During this substrate transfer from one location to another, physical damage to the workpiece may be found, the workpiece may be contaminated, or areas exposed during surface cleaning may be reoxidized, thus substantially reducing yield of the high quality devices.
Additionally, transfer of the workpiece from one location to another requires additional labor effort and precaution to protect the workpiece from being damaged or polluted, thus further increasing the costs and complexity of the manufacturing process and equipment.
Accordingly, despite the use of the existing manufacturing equipment and techniques for fabrication of miniature structures, a long felt need has arisen and exists for equipment and techniques free of the disadvantages of the prior art.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a tool and method for fabrication of miniature structures which carry out both additive and subtractive processes in and with the same apparatus.
It is a further object of the present invention to provide an apparatus for fabrication of miniature structures in which a control unit operates the apparatus in either a “material removal” and/or “material transfer” mode of operation. In this manner by using the same apparatus, either a deposition of a material on the surface of the substrate can be effected or removal of the material from the surface of the substrate can be performed.
It is an object of the present invention to provide an apparatus for manufacturing of miniature structures in which during a “material removal” mode of operation, the control unit permits direct impingement of the energy beam onto the surface of the substrate so that the energy beam “scans” the surface of the substrate in a patterned fashion and removes material from the surface of the substrate in accordance with the type of structure to be created.
An additional object of the present invention is to provide an apparatus and method in which, during the “material transfer” mode of operation, the control unit moves a material carrier element into an intercepting path with the energy beam. When the energy beam impinges on the deposition layer on the material carrier element such causes transference of the material contained in the deposition layer to the surface of the substrate and the material is deposited thereon in a patterned manner in accordance with the type of the structure to be created.
It is still a further object of the present invention to provide an apparatus for fabrication of miniature structures created by equipment which includes a source for the energetic beam, a substrate, a material carrier element having a deposition layer thereon, and a control unit which synchronously manipulates the material carrier element and the energetic beam in accordance with the type of the structure to be created and the type of operation (additive or subtractive) to be performed. In carrying out an additive process, the material carr
Elve M. Alexandra
Potomac Photonics, Inc.
Rosenberg , Klein & Lee
Tran Len
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