Coating apparatus – Gas or vapor deposition – With treating means
Reexamination Certificate
2007-01-02
2007-01-02
Vo, Tuyet (Department: 2821)
Coating apparatus
Gas or vapor deposition
With treating means
C118S7230IR, C118S7230ER, C315S111210, C315S111710
Reexamination Certificate
active
11112317
ABSTRACT:
Provided is an apparatus for fabricating a semiconductor device using plasma, whereby a semiconductor device fabricating process using plasma provides significantly greater uniformity. The apparatus includes a process chamber, a first electrode through which a radio frequency (RF) power is supplied into the process chamber, a second electrode having a semiconductor substrate placed thereon, wherein the second electrode is disposed in the process chamber to face the first electrode and generates plasma used in fabricating a semiconductor device on the semiconductor substrate using the RF power, and a confinement ring assembly disposed between the first electrode and the second electrode, including a first confinement ring that moves in the vertical direction and a second confinement ring that surrounds the first confinement ring and moves in the vertical direction.
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Hyun Jong-Sun
Kang Sung-Woo
F. Chau & Associates LLC
Le Tung
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