Coating apparatus – Gas or vapor deposition – With treating means
Reexamination Certificate
2006-07-18
2006-07-18
Kackar, Ram N (Department: 1763)
Coating apparatus
Gas or vapor deposition
With treating means
C118S728000, C118S724000, C156S345510, C156S345520, C206S832000, C219S444100, C219S544000
Reexamination Certificate
active
07077913
ABSTRACT:
A semiconductor fabricating apparatus having a structure, which facilitates a loading and unloading operation of wafers while having a low effect by a high temperature during a heat treatment. The semiconductor fabricating apparatus includes a plurality of ring-shaped holder having brims and recessed portions, the brims for mounting the to-be-processed wafers thereon, thereby performing the required heat treatment. A tweezer plate of a wafer loading-transferring device is inserted onto the recessed portion or taken out therefrom, and the inserted tweezer plate is ascended or descended, so that the wafer can be inserted on the brims or taken out therefrom.
REFERENCES:
patent: 5275521 (1994-01-01), Wada
patent: 6062853 (2000-05-01), Shimazu et al.
patent: 6099302 (2000-08-01), Hong et al.
patent: 6576064 (2003-06-01), Griffiths et al.
patent: 2001/0001953 (2001-05-01), Griffiths et al.
patent: 62-066527 (1987-04-01), None
patent: 4133417 (1992-05-01), None
patent: 6163440 (1994-06-01), None
patent: 9237781 (1997-09-01), None
patent: 9251961 (1997-09-01), None
patent: 10050626 (1998-02-01), None
patent: 10321543 (1998-12-01), None
patent: 11-40509 (1999-02-01), None
patent: WO 00019502 (2000-04-01), None
Bacon & Thomas PLLC
Hitachi Kokusai Electric Inc.
Kackar Ram N
LandOfFree
Apparatus for fabricating a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for fabricating a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for fabricating a semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3565249