Apparatus for evaluating a bond

Details Apparatus for evaluating a bond Apparatus for evaluating a bond

1975-10-22

1978-07-18

Queisser, Richard C.

Measuring and testing

Vibration

By mechanical waves

73612, 73615, G01N 2900

Patent

active

041008081

ABSTRACT:
Disclosed is an apparatus and method for evaluating a bond between first and second structures bonded together by an intermediate layer of adhesive. Apparatus is provided for transmitting a pulse of ultrasonic wave energy that has a duration at least as short as 1.5 wave cycles into the bonded structures whereby a first reflected pulse may be reflected from a first surface of the first structure, a second reflected pulse reflected from the layer of adhesive, and a third pulse possibly reflected from the surface of the second structure adjacent the adhesive layer. Circuits are provided for sensing the first, second, and third reflected pulses and for providing an indication of the quality of the bond by comparing the amplitudes of the reflected pulses and determining if the ratios lie within predetermined ranges.

REFERENCES:
patent: 2846874 (1958-08-01), Horn
patent: 2903886 (1959-09-01), Renault
patent: 3014364 (1961-12-01), Crooks
patent: 3016735 (1962-01-01), Arnold
patent: 3335602 (1967-08-01), Martner
patent: 3564903 (1971-02-01), Woodmansee
patent: 3576126 (1971-04-01), Weighart
patent: 3640122 (1972-02-01), Nusbickel
patent: 3813926 (1974-06-01), Stubbeman
patent: 3924454 (1975-12-01), McElroy

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