Apparatus for etching wafer by single-wafer process and...

Etching a substrate: processes – Nongaseous phase etching of substrate

Reexamination Certificate

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C216S092000

Reexamination Certificate

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08066896

ABSTRACT:
An apparatus for etching a wafer by a single-wafer process comprises a fluid supplying device which feeds an etching fluid on a wafer, and a wafer-chuck for horizontally holding the wafer. The wafer-chuck is equipped with a gas injection device for injecting a gas to the wafer, a first fluid-aspirating device, and a second fluid-aspirating device. The etching fluid supplied on the wafer is spread by a rotation of the wafer. The etching fluid is scattered by a centrifugal force, or flows down over an edge portion of the wafer and is blown-off by the gas injected from the gas injection unit, and is aspirated by the first fluid-aspirating device or the second fluid-aspirating device.

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European Search Report from corresponding European Application No. EP06021737, dated Dec. 11, 2008.

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