Apparatus for etching wafer by single-wafer process

Details Apparatus for etching wafer by single-wafer process Apparatus for etching wafer by single-wafer process

2006-10-17

2009-02-10

MacArthur, Sylvia R. (Department: 1792)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With gas inlet structure

C156S345550, C156S345170, C134S153000, C134S902000

Reexamination Certificate

active

07488400

ABSTRACT:
An apparatus for etching a wafer by a single-wafer process comprises a fluid supplying device which feeds an etching fluid on a wafer, and a wafer-chuck for horizontally holding the wafer. The wafer-chuck is equipped with a gas injection device for injecting a gas to the wafer, a first fluid-aspirating device, and a second fluid-aspirating device. The etching fluid supplied on the wafer is spread by a rotation of the wafer. The etching fluid is scattered by a centrifugal force, or flows down over an edge portion of the wafer and is blown-off by the gas injected from the gas injection unit, and is aspirated by the first fluid-aspirating device or the second fluid-aspirating device.

REFERENCES:
patent: 4968375 (1990-11-01), Sato et al.
patent: 6159288 (2000-12-01), Satou et al.
patent: 2007/0087568 (2007-04-01), Koyata et al.
patent: 11-289002 (1999-10-01), None

Affiliated with

Also associated with

Rating

Apparatus for etching wafer by single-wafer process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for etching wafer by single-wafer process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for etching wafer by single-wafer process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4060172