Apparatus for etching the edges of semiconductor plates

Details Apparatus for etching the edges of semiconductor plates Apparatus for etching the edges of semiconductor plates

1976-10-04

1978-09-12

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156639, 156654, H01L 21306

Patent

active

041135431

ABSTRACT:
A mechanochemical method of etching the side wall of circular semiconductor plates, and apparatus for performing the method. The plates are given a rotary movement while their side walls only are contacted with an etching solution, the rotary movement being produced by rotation of at least one cylindrical roller dragging along a film of the etching solution.

REFERENCES:
patent: 3964957 (1976-06-01), Walsh
IBM Technical Disclosure Bulletin, vol. 8, No. 12, May 1966, Semiconductor Wafer Handling Apparatus for Chemical Etching Operations by C. E. Hallas, p. 1845.

Affiliated with

Also associated with

Rating

Apparatus for etching the edges of semiconductor plates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for etching the edges of semiconductor plates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for etching the edges of semiconductor plates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2382708