Apparatus for enhanced rate chemical mechanical polishing...

Details Apparatus for enhanced rate chemical mechanical polishing... Apparatus for enhanced rate chemical mechanical polishing...

2005-06-14

2005-06-14

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

With critical temperature modification or control of work or...

C451S007000, C451S287000

Reexamination Certificate

active

06905397

ABSTRACT:
A chemical mechanical polishing apparatus is described, which includes a platen, a polishing pad that is attached to the platen, and a means for adjusting the temperature of the polishing pad.

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