Plastic article or earthenware shaping or treating: apparatus – With means applying coating material to work or work contact... – Means contacting work downstream of shaping member
Patent
1986-03-05
1988-01-26
Hoag, Willard E.
Plastic article or earthenware shaping or treating: apparatus
With means applying coating material to work or work contact...
Means contacting work downstream of shaping member
53140, 118415, 425101, 425122, 425383, 425394, 425397, 425347, B29C 3902, B29C 3926, B29C 3938
Patent
active
047214538
ABSTRACT:
A semiconductor encapsulating apparatus including a positioning apparatus positioning an encapsulant premold (preformed piece or pellet) in contact with the semiconductor and the curing apparatus through which the semiconductor and encapsulant are passed to cure and thereby encapsulate the semiconductor. The encapsulating apparatus may include a vacuum chamber to degass the encapsulant prior to curing, a robotic arm to position an encapsulant premold in contact with the semiconductor and encapsulant premold forming apparatus including a die engaging a plastically deformable strip to form therein a mold. Also included may be a mold filling dispenser, a mold solidifying bath which may include liquid nitrogen, a solidified premold ejecting roller and a premold storage tray. Also disclosed are roller and spray coating apparatuses adapted to coat an inner surface of the mold with a release agent thereby to promote subsequent premold release.
REFERENCES:
patent: 3659821 (1972-05-01), Sakamoto et al.
patent: 3693252 (1972-09-01), Robertson et al.
patent: 4374080 (1983-02-01), Schroeder
patent: 4443173 (1984-04-01), Mansberger
patent: 4451973 (1984-06-01), Tateno et al.
patent: 4540533 (1985-09-01), Sahakian
patent: 4563320 (1986-01-01), Morgan
Black Robert J.
GTE Communication Systems Corporation
Hendricks Gregory G.
Hoag Willard E.
LandOfFree
Apparatus for encapsulating semiconductors does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for encapsulating semiconductors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for encapsulating semiconductors will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1466528