Apparatus for encapsulating an integrated circuit package

Details Apparatus for encapsulating an integrated circuit package Apparatus for encapsulating an integrated circuit package

1995-05-26

1996-10-29

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

29855, 174 522, 257675, 26427217, 361813, 437219, H05K 720

Patent

active

055702724

ABSTRACT:
The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing between the heatsink and the inner surface of a mold cavity. As a consequence, the bottom of the heatsink is not encapsulated and is thus exposed. This is accomplished by including posts, attached to the leadframe assembly, which have the function of exerting a downward force on a leadframe assembly and, in turn, on the heatsink. Tie bars, which are non-functional parts of a leadframe assembly, can be utilized as posts by bending the posts into an upright position.

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patent: 5420752 (1995-05-01), Variot

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