Apparatus for encapsulating a semiconductor device

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds

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425127, B29C 3910, B29C 4102

Patent

active

051182718

ABSTRACT:
An elastic material covering an outer surface of a cavity plate but not covering any clamping surfaces of the cavity plate or the inner surface of the cavity plate is used to eliminate use of a dam bar in a lead frame. In an embodiment in accordance with the present invention the elastic material provides a supplementary seal to the clamping surfaces of the cavity plate and a primary seal in spaces between leads of the encapsulated lead frame. In a method of using the present invention, the elastic material is placed between the mold base and the cavity plate. A semiconductor lead frame to be encapsulated is placed in cavities provided by the cavity plate. The mold is closed so that clamping surfaces of the cavity plate clamp directly onto the leads. The elastic material deforms under pressure to compensate for any dimensional variations of the mold plates or lead frame and completely seals the space between leads.

REFERENCES:
patent: 3009578 (1961-11-01), Foote et al.
patent: 4236689 (1980-12-01), Hass
patent: 4626185 (1986-12-01), Monnet
patent: 4686073 (1987-08-01), Koller
patent: 4686765 (1987-08-01), Byers et al.
patent: 4688752 (1987-08-01), Barteck et al.

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