Apparatus for electroplating strip material without current leak

Chemistry: electrical and wave energy – Apparatus – Electrolytic

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204 15, 204206, C25D 502, C25D 508, C25D 706

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active

043234410

ABSTRACT:
Apparatus for the production of metal foil or printed circuit patterns on a continuously advancing strip of electrically conductive material includes a cathode under which the conductive strip is fed in sliding contact therewith. An insoluble anode is disposed under the cathode, with an interelectrode gap between the anode and the cathodic conductive strip traveling under the cathode. Lying next to one end of the anode is a solution inlet block defining a solution inlet from which the electroplating solution containing the metal to be deposited is fed turbulently into the interelectrode gap to cause the electrodeposition of the metal on the downward-facing surface of the conductive strip. A shield block of electrically insulating material is mounted over the solution inlet block for shielding the conductive strip traveling thereover from premature metal deposition due to leaking current and hence for avoiding the development of pinholes in the metal foil or circuit patterns.

REFERENCES:
patent: 4030999 (1977-06-01), Allen
patent: 4119516 (1978-10-01), Yamaguchi

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