Apparatus for electroplating limited surfaces on a workpiece

Details Apparatus for electroplating limited surfaces on a workpiece Apparatus for electroplating limited surfaces on a workpiece

1986-09-30

1988-06-14

Valentine, Donald R.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204272, 204275, C25D 1700, C25D 1712

Patent

active

047509813

ABSTRACT:
Disclosed is a method and apparatus for plating selected portions of a workpiece that cannot suitably be plated in dip-tank processes. The invention is particularly suitable for plating apertures in large parts. The aperture is enclosed between two containers, one on each side of the aperture. The containers are held in sealing position on the workpiece by means of an elongated rod that passes through both containers and through the aperture. Fastening means threaded onto each end of the rod engage container surfaces to urge the containers into sealing engagement with the workpiece, completely enclosing the aperture to be plated. An anode connected to a power source is mounted upon the elongated rod, preferably positioned substantially within the aperture. Application of a current with the workpiece connected to a cathode results in plating of the aperture.

REFERENCES:
patent: Re29874 (1979-01-01), Becker
patent: 2739937 (1956-03-01), Forestek
patent: 3036967 (1962-05-01), Lapham
patent: 3071521 (1963-01-01), Ehrhart
patent: 3546088 (1970-12-01), Barkman et al.
patent: 3860499 (1975-01-01), Graham et al.
patent: 3869372 (1975-03-01), Becker
patent: 3974042 (1976-08-01), Angelini
patent: 4082638 (1978-04-01), Jumer
patent: 4125447 (1978-11-01), Bachert
patent: 4224117 (1980-09-01), Edwards et al.
patent: 4447306 (1984-05-01), Ushio et al.

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