Apparatus for electroplating electrical contacts

Chemistry: electrical and wave energy – Apparatus – Electrolytic

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C25D 1700

Patent

active

052231100

ABSTRACT:
A method and apparatus for selectively electroplating a metallic coating, such as solder, onto a plurality of small and closely spaced electrical contacts. The method includes sealingly enclosing the contacts in an electroplating cell having an anode, a cathode and a chamber, forming an electrical connection between the cathode and the contacts and electroplating the contacts.

REFERENCES:
patent: 5032234 (1991-07-01), Oku
"Hunter Mini-Plating Pens Ultra-Compact Electro Plating System With Marker Pen Convenience," Hunter Products, Inc. Bridgewater, NJ, pp. 1-4.
"Enthone-OMI SEL-REX," ENTHONE-OMI, INC., New Haven, Conn., Mar. 1987, pp. 1-8.
"Carousel Data 35/22," S. G. OWEN LTD., Philadelphia, Pa., pp. 1-2.
"Flip-Top Data 35/25", S. G. OWEN LTD., Philadelphia, Pa. pp. 1-2.
"Mini-Lab Data 34/23," S. G. Owen Ltd., Philadelphis, Pa., pp. 1-2.

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