Apparatus for electroplating a metal wire of relatively low elec

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C25D 706, C25D 1300, C25D 1316

Patent

active

043859771

ABSTRACT:
The present invention relates to an apparatus for electroplating a metal wire of a relatively low electric conductivity. Said wire is wound onto a cylindrical frame which connects said wire to a cathode at many contact points which are changed at certain intervals by a rocking motion.

REFERENCES:
patent: 2477808 (1949-08-01), Jones
patent: 3483113 (1969-12-01), Carter
patent: 3900383 (1975-08-01), Austin et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for electroplating a metal wire of relatively low elec does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for electroplating a metal wire of relatively low elec, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for electroplating a metal wire of relatively low elec will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2245161

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.