Apparatus for electrophoretic application of a lacquer onto plat

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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Details

204299EC, 204202, C25D 1300

Patent

active

052231160

ABSTRACT:
For the electrophoretic application of a lacquer onto plate-shaped work pieces, the work pieces are conveyed on a horizontal throughput path through a cell wherein a lacquer deposition bath and at least one electrode are situated. The anodic or cathodic contacting of the traversing work pieces occurs via an endlessly circulating contacting drive preferably formed by a metal band and via a contact element arranged outside the cell for the feed of the anode current or cathode current to the contacting drive. The lacquer deposited on the contacting drive in the cell is in turn removed via a cleaning arrangement outside the cell and, thus, a reliable contacting of the work pieces is guaranteed. The apparatus is particularly suitable for the electrophoretic application of etching resists, plating resists and solder resists onto printed circuit boards.

REFERENCES:
patent: 4322280 (1982-03-01), Houska et al.
patent: 4402800 (1983-09-01), Ash et al.
patent: 4755271 (1988-07-01), Hosten
patent: 4776939 (1988-11-01), Blasing et al.
patent: 4832811 (1989-05-01), Hosten
patent: 4948483 (1990-08-01), Hosten
patent: 4948486 (1990-08-01), Hosten

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