Apparatus for electronically seam fusing dissimilar polymeric ma

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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1565831, 1565832, 1565834, 156358, 156359, 156498, C09J 500

Patent

active

054725496

ABSTRACT:
A device for electronically seam fusing similar or dissimilar multiple polymeric materials by placing the materials between two opposing plates, wherein the plates have cooling tubes disposed within the plates and have the required combination of heating elements, non-stick heat barriers, and configuration enhancers disposed thereon. The opposing plates are then closed by a force which is regulated by a control feature which also governs the timing, length and temperature that is utilized by the heat elements and cooling tubes of the invention. Upon completion of the electronic seam fuse cycle, the multiple layers of polymeric materials will be fused together, and separated if desired, thus creating a seam that will be as strong or stronger than the individual material.

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