Apparatus for electrochemically processing a workpiece including

Details Apparatus for electrochemically processing a workpiece including Apparatus for electrochemically processing a workpiece including

1998-07-10

2000-06-27

Gorgos, Kathryn

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204212, C25D 1704, C25D 1706

Patent

active

06080291&

ABSTRACT:
A plating apparatus, such as for electroplating of semiconductor wafers or like workpieces, includes a plating contact including an annular contact ring having an annular mounting portion, and an annular electrically-conductive contact portion extending inwardly of the mounting portion. The contact portion is configured for substantially continuous electrically-conductive contact with a peripheral region of the associated workpiece. The arrangement further includes an annular seal member mounted on the annular contact ring, with the seal member including a resiliently deformable annular seal lip portion adjacent to the contact portion of the contact ring. The seal lip is resiliently biased into continuous sealing engagement with the peripheral region of the workpiece when the workpiece is positioned in electrically-conductive contact with the contact ring. The apparatus includes a rotor assembly configured to receive the workpiece, and move the workpiece into operative contact with the annular contact ring and the annular seal member.

REFERENCES:
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patent: 5227041 (1993-07-01), Brogden et al.
patent: 5441629 (1995-08-01), Kosaki
patent: 5744019 (1998-04-01), Ang

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