Abrading – Precision device or process - or with condition responsive... – Computer controlled
Patent
1997-03-26
1999-06-15
Rose, Robert A.
Abrading
Precision device or process - or with condition responsive...
Computer controlled
451287, B24B 722
Patent
active
059116196
ABSTRACT:
A method of planarizing a layer of a workpiece such as a semiconductor wafer includes rotating the layer against an electrolytic polishing slurry and flowing an electrical current through the slurry and through only one major side and/or minor sides of the layer, to remove portions of the layer. The one major side carries no microelectronic components which might be damaged by the current. At least a part of each step of rotating and of flowing occurs simultaneously. An apparatus for planarizing a layer includes a rotatable workpiece carrier, a rotatable platen arranged proximately to the carrier, a polishing pad mounted on the platen, and workpiece electrodes. The workpiece electrodes are movably attached to the carrier so as to engage electrically the minor sides of a layer when a workpiece is held on the carrier.
REFERENCES:
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4934102 (1990-06-01), Leach et al.
patent: 5225034 (1993-07-01), Yu et al.
patent: 5534106 (1996-07-01), Cote et al.
patent: 5543032 (1996-08-01), Datta et al.
patent: 5567300 (1996-10-01), Datta et al.
patent: 5575706 (1996-11-01), Tsai et al.
Harper James McKell Edwin
Uzoh Cyprian Emeka
Abate Joseph P.
International Business Machines - Corporation
Rose Robert A.
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