Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2004-09-30
2010-02-09
Reichard, Dean A. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000, C361S733000, C361S767000, C361S785000, C361S808000, C439S078000, C439S079000, C439S055000, C439S083000
Reexamination Certificate
active
07660128
ABSTRACT:
A circuit package includes a circuit substrate having a cutout portion defined therein, an interconnect electrically coupled to the circuit substrate and an active circuit component disposed off the circuit substrate within the cutout portion and electrically coupled to the interconnect. An optical circuit includes a lead frame and an optical component electrically coupled to the lead frame. The lead frame includes a first lead portion at a first level having an upper surface and a lower surface, and a second lead portion at a second level lower than the first level and electrically connected to the first lead portion. The lower surface of the first lead portion is arranged to electrically connect to a surface of a circuit substrate. The second lead portion includes an upper surface and a lower surface. The optical component is disposed on the upper surface of the second lead portion.
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Crews Darren S.
Xu Lee L.
Emcore Corporation
Nguyen Hoa C
Reichard Dean A.
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