Drying and gas or vapor contact with solids – Apparatus – With means to treat gas or vapor
Patent
1987-03-12
1988-09-06
Schwartz, Larry I.
Drying and gas or vapor contact with solids
Apparatus
With means to treat gas or vapor
34 36, 34198, 34218, F26B 304
Patent
active
047682914
ABSTRACT:
A method and apparatus of dry processing a semiconductor wafer including processes of vacuum baking and dry silylation provides a gaseous atmosphere of pressure up to 760 Torr against the surface of the wafer, one or more of the constituents of the gas being obtained from a liquid fluid source of the constituent, including a metering device that controls flow of the liquid fluid from a remote reservoir and feeds it to a vaporizer that converts the fluid to a vapor gas at pressure up to 760 Torr and feeds the vapor gas at that pressure into a wafer processing chamber where the particular dry process involving the vapor gas is carried out on the wafer surface. In a preferred embodiment the metering device is an automotive fuel injector, sometimes referred to as a throttle body injector (TBI) that is energized by electrical pulses, each electrical pulse causing the TBI to inject a given predetermined amount into the vaporizer which heats the fluid, turning it into a vapor gas at pressure up to 760 Torr.
REFERENCES:
patent: 3236073 (1966-02-01), Davison et al.
patent: 3943904 (1976-03-01), Byrne
patent: 4592926 (1986-06-01), Rubin et al.
Dunn Robert T.
Monarch Technologies Corporation
Schwartz Larry I.
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