Apparatus for dividing an adhesive film mounted on a wafer

Details Apparatus for dividing an adhesive film mounted on a wafer Apparatus for dividing an adhesive film mounted on a wafer

2005-07-28

2009-10-13

Nguyen, Thanh (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S620000, C257SE23078, C156S349000

Reexamination Certificate

active

07602071

ABSTRACT:
A method of dividing an adhesive film mounted on the back surface of a wafer having a plurality of streets formed on the front surface in a lattice pattern and function elements formed in a plurality of areas sectioned by the plurality of streets, along the streets in a state where the wafer is put on the surface of a protective tape mounted on an annular frame, wherein the adhesive film is cooled and the protective tape is expanded to divide the adhesive film along the peripheries of the function elements.

REFERENCES:
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patent: 2004/0104491 (2004-06-01), Connell et al.
patent: 2005/0023260 (2005-02-01), Takyu et al.
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patent: 1348208 (2002-05-01), None
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patent: 2000-182995 (2000-06-01), None
patent: 2002-118081 (2002-04-01), None
patent: 3408805 (2003-03-01), None

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