Apparatus for dissipating heat in a hinged computing device

Details Apparatus for dissipating heat in a hinged computing device Apparatus for dissipating heat in a hinged computing device

1996-07-15

1997-04-15

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

622592, 16510433, 361700, 3647081, H05K 720

Patent

active

056216130

ABSTRACT:
A heat transfer apparatus providing thermal coupling between a first and a second hinged member. The first hinged member is a first computer housing member, and the second hinged member is a second computer housing member. The first and the second computer housing members are rotatably attached allowing pivotal motion along an axis substantially parallel to the first edge. A first embodiment has a spiraled heat transfer element with a inner edge thermally coupled to a heat conductive mounting element mounted along the first edge of the first computer housing member. The spiraled heat transfer element forms at least one turn around the heat conductive mounting element and has outer edge affixed to the second computer housing member. A second embodiment provides heat transfer between the first and second computer housing members through the gudgeon and the pintle of the hinge.

REFERENCES:
patent: 4084213 (1978-04-01), Kirchner
patent: 4730364 (1988-03-01), Tat-Kee
patent: 4980848 (1990-12-01), Griffin
patent: 4993482 (1991-02-01), Dolbear et al.
patent: 5117901 (1992-06-01), Cullimore
patent: 5129448 (1992-07-01), Holmbert, Jr. et al.
patent: 5195213 (1993-03-01), Ohgami et al.
patent: 5237486 (1993-08-01), LaPointe
patent: 5313362 (1994-05-01), Hatada
patent: 5383340 (1995-01-01), Larson et al.
patent: 5424913 (1995-06-01), Swindler

Affiliated with

Also associated with

Rating

Apparatus for dissipating heat in a hinged computing device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for dissipating heat in a hinged computing device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for dissipating heat in a hinged computing device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-365854