Apparatus for dissipating heat from an integrated circuit

Details Apparatus for dissipating heat from an integrated circuit Apparatus for dissipating heat from an integrated circuit

1995-07-31

1996-12-31

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257719, 361719, H05K 720

Patent

active

055900267

ABSTRACT:
A heat sink apparatus dissipates heat from an integrated circuit which is connected to a printed circuit board. A support member is connected to the circuit board for supporting the integrated circuit with respect to the circuit board. A metal tab in thermal communication with the integrated circuit extends from the support member in a plane substantially parallel to the circuit board. An electrically insulating thermally conductive compressible pad is positioned in contact with the metal tab for receiving heat from the tab when compressed. A thermally conductive housing is positioned adjacent the pad for compressing the pad against the tab and for receiving heat from the pad when compressed. The housing includes a plurality of fins extending therefrom for heat dissipation. A method for dissipating heat from an integrated circuit which is connected to a printed circuit board is also provided.

REFERENCES:
patent: 4756081 (1988-07-01), Penn
patent: 5175613 (1992-12-01), Barker, III
patent: 5305185 (1994-04-01), Samarov
patent: 5424919 (1995-06-01), Heilbronner
patent: 5430609 (1995-07-01), Kikinis
patent: 5473510 (1995-12-01), Dozler, II

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