Apparatus for dissipating heat from a conductive layer in a circ

Details Apparatus for dissipating heat from a conductive layer in a circ Apparatus for dissipating heat from a conductive layer in a circ

1997-12-16

1999-08-03

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361704, 361707, 361718, 361719, 257717, 174 163, 174 161, 165 803, 165185, H05K 720

Patent

active

059333243

ABSTRACT:
An apparatus for dissipating heat transferred to a circuit board. A board on which to mount an electronic device includes a conductive layer. A first board heat dissipation element is thermally coupled to the conductive layer and extends away from a surface of the board to dissipate heat from the conductive layer to the ambient.

REFERENCES:
patent: 4682269 (1987-07-01), Pitasi
patent: 4698663 (1987-10-01), Sugimoto et al.
patent: 4720770 (1988-01-01), Jameson
patent: 4823234 (1989-04-01), Konishi et al.
patent: 5113315 (1992-05-01), Capp et al.
patent: 5561324 (1996-10-01), Kozono et al.
patent: 5659458 (1997-08-01), Patchen
patent: 5661902 (1997-09-01), Katchmar

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