Apparatus for dispensing solder paste

Coating apparatus – Solid applicator contacting work – With work-handling or work-supporting

Patent

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Details

118406, B05C 502

Patent

active

046932097

ABSTRACT:
A solder paste dispensing assembly provides for the controlled application of a predetermined solder paste pattern to a surface. The surface can be on a printed circuit board, prior to or after the board is mounted onto an assembled product or it can be a portion of the product itself. The surface can be a planar or non-planar surface.

REFERENCES:
patent: 3384931 (1968-05-01), Cochran et al.
patent: 4469044 (1984-09-01), Bloom et al.

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