Apparatus for dip-molding and enclosed loop

Details Apparatus for dip-molding and enclosed loop Apparatus for dip-molding and enclosed loop

1997-12-08

1999-07-13

Davis, Robert

Plastic article or earthenware shaping or treating: apparatus

Dipping type shaping means

Dipping form per se

264303, B29C 3344, B29C 4140

Patent

active

059223650

ABSTRACT:
An apparatus and method is disclosed for forming enclosed loops in plastic parts using a mandrel-dip method. A mandrel is formed with a loop attached to the mandrel at one end, but separated from the mandrel at the other end by a gap. The process for forming the plastic part with an enclosed loop includes heating and dipping the mandrel into a vat containing a plastic or other resin and allowing the resin to bridge the gap in the loop. Once the resin cures, the mandrel is removed from the resin by injecting air into the plastic part between the mandrel and the plastic part. By doing so, the mandrel easily separates from the plastic part without needing to cut the mandrel or the plastic part.

REFERENCES:
patent: 2053357 (1936-09-01), Winder
patent: 2451758 (1948-10-01), Malm
patent: 5133923 (1992-07-01), Klug
patent: 5380182 (1995-01-01), Packard et al.

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