Coating apparatus – With cutting – punching or tearing of work – Web or sheet work
Patent
1976-04-05
1978-12-12
Stein, Mervin
Coating apparatus
With cutting, punching or tearing of work
Web or sheet work
148189, 432253, C23C 1308
Patent
active
041290909
ABSTRACT:
In diffusing an impurity into semiconductor wafers within a silica tube by the use of a heating furnace, a method of diffusion involves the following steps: the semiconductor wafers are inserted into the tube from an inlet thereof, the inlet is sealed by a cap, the interior of the tube is placed under vacuum, and an atmosphere of the impurity is formed. Since, at heating, the tube is closed and no inert gas is fed thereinto, the temperature distribution within the tube is held uniform, and hence the quantities of impurity introduction into the semiconductor wafers are not varied.
REFERENCES:
patent: 3085032 (1963-04-01), Fuller
patent: 3183130 (1965-05-01), Reynolds et al.
patent: 3281291 (1966-10-01), Greenberg et al.
patent: 3314833 (1967-04-01), Arndt et al.
patent: 3374125 (1968-03-01), Goldsmith
patent: 3530016 (1970-09-01), Joseph
patent: 3577287 (1971-05-01), Norwich et al.
patent: 3578495 (1971-05-01), Pammer et al.
patent: 3676231 (1972-07-01), Medvecky et al.
patent: 3755017 (1973-08-01), Coughlin
patent: 3764414 (1973-10-01), Blum et al.
patent: 3826377 (1974-07-01), Bachmann
patent: 3852128 (1974-12-01), Kreuzer
Inaniwa Keizo
Ryugo Noboru
Hitachi , Ltd.
Stein Mervin
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