Apparatus for dicing a semiconductor device substrate and a proc

Details Apparatus for dicing a semiconductor device substrate and a proc Apparatus for dicing a semiconductor device substrate and a proc

1996-12-26

1999-05-18

Picardat, Kevin M.

Semiconductor device manufacturing: process

Semiconductor substrate dicing

438465, H01L21/301

Patent

active

059045477

ABSTRACT:
An integrated apparatus (10) has a dicing station (14) and a rinsing/heated drying station (16). In one embodiment, the rinsing/heated drying station (16) has a heater, such as an infrared lamp (36), or uses a heated gas. The integrating apparatus (10) helps to decrease the time between dicing and heated drying, which reduces the likelihood of corrosion of C4 bumps (64).

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patent: 3997963 (1976-12-01), Riseman
patent: 4086375 (1978-04-01), LaChapelle, Jr. et al.
patent: 4925808 (1990-05-01), Richardson
patent: 5091331 (1992-02-01), Delgado et al.
patent: 5136354 (1992-08-01), Morita et al.
patent: 5272114 (1993-12-01), Van Berkum et al.
patent: 5358590 (1994-10-01), Yamanaka
Kulicke & Soffa Industries, Inc.; Fully Automated Wafer Dicing System Model 7500 brouchere (3 pages); 1995.
Ultra t Equipment Company, Inc.; Sawed/Scribed Wafer Cleaner Model SWC111M (1 page); 1992.

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