Apparatus for determining removed amount of wafer

Details Apparatus for determining removed amount of wafer Apparatus for determining removed amount of wafer

1997-12-17

1999-09-07

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

216 84, 216 86, 216 88, 438691, 438 17, 438 14, C23F 102, B44C 122, H01L 21302

Patent

active

059482060

ABSTRACT:
The differential transformer is secured to the wafer holding table provided in the head, and the core of the differential transformer is secured to the rod member, which is provided to the head and freely projects and retracts from the face of the wafer. Then, the tip of the rod member is in contact with the polishing pad and keeps the core at a constant height from the polishing pad during polishing. When the head is displaced as polishing progresses with respect to the polishing pad, the differential transformer is displaced in connection with the displacement of the head. Therefore, the removed amount of the wafer can be determined by measuring the displacement amount of the differential transformer with respect to the core.

REFERENCES:
patent: 5213655 (1993-05-01), Leach et al.
patent: 5559428 (1996-09-01), Li et al.
patent: 5834645 (1998-11-01), Bartels et al.

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