Apparatus for determining mark position on wafer

Details Apparatus for determining mark position on wafer Apparatus for determining mark position on wafer

1997-11-06

1999-03-02

Hantis, K. P.

Radiant energy

Means to align or position an object relative to a source or...

25049223, G01N 2300

Patent

active

058775056

ABSTRACT:
In an apparatus scanning an alignment mark formed on a silicon substrate by an electron beam to determine the center position of the alignment mark based on the reflected signal waveform, a proportional relationship holds between a beam size which is the thickness of the electron beam and the amount of offset between the detected mark position and the actual mark position. More specifically, when the beam size is small, the amount of offset of the detected position from the actual position is small. In the mark position determining apparatus according to the present invention, the alignment mark is detected a plurality of times by the electron beams having a plurality of sizes, and based on the mark detection positions obtained by the respective detections, the mark detection position when scanning is carried out by an electron beam having a beam size of 0 is calculated.

REFERENCES:
patent: 5172189 (1992-12-01), Mitome
patent: 5468969 (1995-11-01), Itoh et al.
"Improved Registration Accuracy in E-Beam Direct Writing Lithography," by Yoshikatsu KOJIMA et al., Jpn. J. Appln Phys., vol. 32, Part 1, No. 12B, Dec. 1993.

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