Apparatus for determining burn-in reliability from wafer...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C324S763010, C365S201000

Reexamination Certificate

active

06894526

ABSTRACT:
An apparatus for determining burn-in reliability from wafer level burn-in is disclosed. The apparatus according to the present invention includes nonvolatile elements on an integrated circuit for recording the number of failures at various points in time over the duration of wafer level burn-in testing. The number of failures in each IC die, along with their associated points in time, may be used to create burn-in reliability curves which are conventionally derived using other processes that may be less cost effective or not possible to effect with unpackaged IC dice. A memory device associated with the method of the present invention is also disclosed.

REFERENCES:
patent: 4032949 (1977-06-01), Bierig
patent: 4455495 (1984-06-01), Masuhara et al.
patent: 4534014 (1985-08-01), Ames
patent: 4592025 (1986-05-01), Takemae et al.
patent: 4707806 (1987-11-01), Takemae et al.
patent: 5110754 (1992-05-01), Lowrey et al.
patent: 5235550 (1993-08-01), Zagar
patent: 5254943 (1993-10-01), Momose
patent: 5296402 (1994-03-01), Ryou
patent: 5301143 (1994-04-01), Ohri et al.
patent: 5313424 (1994-05-01), Adams et al.
patent: 5345110 (1994-09-01), Renfro
patent: 5352945 (1994-10-01), Casper et al.
patent: 5424652 (1995-06-01), Hembree et al.
patent: 5428311 (1995-06-01), McClure
patent: 5440240 (1995-08-01), Wood et al.
patent: 5457400 (1995-10-01), Ahmad et al.
patent: 5539235 (1996-07-01), Allee
patent: 5563832 (1996-10-01), Kagami
patent: 5590069 (1996-12-01), Levin
patent: 5600171 (1997-02-01), Makihara et al.
patent: 5606193 (1997-02-01), Ueda et al.
patent: 5617366 (1997-04-01), Yoo
patent: 5619469 (1997-04-01), Joo
patent: 5677917 (1997-10-01), Wheelus et al.
patent: 5768288 (1998-06-01), Jones
patent: 5867505 (1999-02-01), Beffa
patent: 5895962 (1999-04-01), Zheng et al.
patent: 5896398 (1999-04-01), Sekine
patent: 5982189 (1999-11-01), Motika et al.
patent: 5991220 (1999-11-01), Freyman et al.
patent: 6002620 (1999-12-01), Tran et al.
patent: 6008523 (1999-12-01), Narayan et al.
patent: 6016265 (2000-01-01), Yoshida et al.
patent: 6021078 (2000-02-01), Le et al.
patent: 6025129 (2000-02-01), Nova et al.
patent: 6118138 (2000-09-01), Farnworth
patent: 6127837 (2000-10-01), Yamamoto et al.
patent: 6190972 (2001-02-01), Zheng et al.
patent: 6194738 (2001-02-01), Debenham et al.
patent: 6212114 (2001-04-01), Cowles
patent: 6233182 (2001-05-01), Satou et al.
patent: 6269035 (2001-07-01), Cowles et al.
patent: 6292009 (2001-09-01), Farnworth et al.
patent: 6324657 (2001-11-01), Fister et al.
patent: 6343366 (2002-01-01), Okitaka
patent: 6353563 (2002-03-01), Hii et al.
patent: 6365421 (2002-04-01), Debenham et al.
patent: 20020133767 (2002-09-01), Cowles
patent: 20020133769 (2002-09-01), Cowles et al.
patent: 20020133770 (2002-09-01), Cowles et al.
Copy of U.S. Appl. No. 09/651,858, filed Aug. 30, 2000.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for determining burn-in reliability from wafer... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for determining burn-in reliability from wafer..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for determining burn-in reliability from wafer... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3411564

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.