Apparatus for determining burn-in reliability from wafer...

Details Apparatus for determining burn-in reliability from wafer... Apparatus for determining burn-in reliability from wafer...

2005-05-17

2005-05-17

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S763010, C365S201000

Reexamination Certificate

active

06894526

ABSTRACT:
An apparatus for determining burn-in reliability from wafer level burn-in is disclosed. The apparatus according to the present invention includes nonvolatile elements on an integrated circuit for recording the number of failures at various points in time over the duration of wafer level burn-in testing. The number of failures in each IC die, along with their associated points in time, may be used to create burn-in reliability curves which are conventionally derived using other processes that may be less cost effective or not possible to effect with unpackaged IC dice. A memory device associated with the method of the present invention is also disclosed.

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Copy of U.S. Appl. No. 09/651,858, filed Aug. 30, 2000.

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