Apparatus for detecting wafer edge defects and method of using

Details Apparatus for detecting wafer edge defects and method of using Apparatus for detecting wafer edge defects and method of using

1999-01-29

2000-05-16

Chapman, John E.

Measuring and testing

Vibration

By mechanical waves

73620, 25055942, 3562371, G01N 924

Patent

active

060620846

ABSTRACT:
An apparatus for detecting defects in a wafer edge and a method for detecting are disclosed. In the apparatus, an ultrasonic detection unit is used to detect crazing or micro-cracks in a wafer edge, while a laser detection unit is used for detecting cracks in the wafer edge. The ultrasonic detection unit and the laser detection unit may be positioned in a detection module together with a wafer platform for holding and rotating a wafer positioned thereon. The detection module is placed in a mini-environment of clean room conditions which also include a robot transport device and a wafer storage cassette. The present invention novel apparatus is compact in size and can be moved to any location in a fab plant such that it is positioned adjacent to a process machine. The present invention novel apparatus can be used to detect crazing (or micro-cracks) and cracks that are present in an edge portion of a wafer which may be caused by external stresses during various processing steps such as polishing, cleaning and edge bead rinsing.

REFERENCES:
patent: 4011748 (1977-03-01), Bono et al.
patent: 4741212 (1988-05-01), Rehwald
patent: 5479252 (1995-12-01), Worster et al.
patent: 5592295 (1997-01-01), Stanton et al.

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