Measuring and testing – Vibration – By mechanical waves
Patent
1997-08-19
1999-03-30
Dombroske, George
Measuring and testing
Vibration
By mechanical waves
73827, 73842, G01N 2908
Patent
active
058892109
ABSTRACT:
A bonding defect detecting apparatus is provided for operation in conjunction with an ultrasonic wire bonder using an ultrasonic oscillator driven by a signal. The apparatus has A/D converters for digitally converting a signal waveform of the signal by real-time sampling during a bonding operation. A digital signal processing device is provided for calculating at least one signal characteristic of each of the signal waveforms for each of a plurality of the bonding operation. A data accumulating devices accumulates the at least one signal characteristic for n number of bonding operations of the plurality of the bonding operation. A calculating device calculates an average signal characteristic of the signal characteristics of the n number of bonding operations. And a comparing device compares the average signal characteristic with a corresponding present signal characteristic of a last bonding operation of the plurality of the bonding operation, occurring after the n number of bonding operations, to thereby determine whether a bonding defect exists. Preferably, the n number of bonding operations are a most recent n number of bonding operations occurring before the last bonding operation. In an embodiment, the signal waveform includes both a voltage waveform and a current waveform from which signal characteristics such as average voltage, average current, peak voltage, peak current, a phase difference between the voltage waveform and a current waveform and an impedance are determined.
REFERENCES:
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patent: 5372042 (1994-12-01), Jarman et al.
patent: 5481917 (1996-01-01), Arima et al.
patent: 5513531 (1996-05-01), Sapia et al.
Dombroske George
Kyushu Electronics Systems, Inc.
Noori Max H.
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