Apparatus for detecting an end point of etching

Details Apparatus for detecting an end point of etching Apparatus for detecting an end point of etching

1991-08-23

1992-06-02

Wityshyn, Michael G.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

422 52, 422 98, 356306, 356316, 364498, C23F 102

Patent

active

051183781

ABSTRACT:
A method of detecting an end point of etching by emission spectroscopy. Using a constant ratio between emission intensities in the course of etching and after the termination thereof, a correction value is computed with data of a waveform already adjusted to be capable of detecting an end point of etching and the corresponding emission intensity in the course of etching treatment thereafter, and the waveform of corresponding emission intensity in the course of etching treatment is processed so that the detection can be conducted on the same level as in the end point detection already adjusted to be capable of detecting the end point of etching at the time of treatment. Thus, irrespective of the reduction of the quantity of emission for an emission detection at each time of treatment, a constant electric signal of the same detecting level can be obtained, making it possible to detect an end point of etching with the same accuracy as in the initial treatment.

REFERENCES:
patent: 4457820 (1984-07-01), Bergeron et al.
patent: 4493745 (1985-01-01), Chen et al.
patent: 4615761 (1986-10-01), Tada et al.
patent: 4846928 (1989-07-01), Dolins et al.
patent: 4847792 (1989-07-01), Barna et al.
patent: 4861419 (1989-08-01), Flinchbaugh et al.

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