Apparatus for depositing solder on the terminal pads of printed

Details Apparatus for depositing solder on the terminal pads of printed Apparatus for depositing solder on the terminal pads of printed

1993-07-29

1996-01-02

Snay, Jeffrey R.

Coating apparatus

Coated surface protecting means, e.g., slip sheets

118101, 118106, 118301, 118316, H05K 334, B05C 504

Patent

active

054804833

ABSTRACT:
An apparatus for depositing solder on the terminal pads of printed circuit boards in which a solder resist layer or layers having a thickness corresponding to the desired solder height border the pads. Molten solder from a reservoir is directed by nozzles against the sides of the board to fill the cavities extending above the terminal pads while the board is moving via a conveyor mechanism relative to the reservoir. The cavities when filled with molten solder are covered by a suitable element such as a flexible belt or roller. The molten solder within the covered cavities is then cooled below its solidification point and the covering element removed. If desired, part or all of the solder resist layer or layers may then be stripped from the board to leave solder pads extending above the surface of the board.

REFERENCES:
patent: 4127692 (1978-11-01), Boynton
patent: 4493857 (1985-01-01), Knigge
patent: 4539069 (1985-09-01), Fishman et al.
patent: 4720324 (1988-01-01), Hayward
patent: 5172853 (1992-12-01), Maiwald

Affiliated with

Also associated with

Rating

Apparatus for depositing solder on the terminal pads of printed does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for depositing solder on the terminal pads of printed , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for depositing solder on the terminal pads of printed will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-232607